The TLP579xH series is housed in a small SO6L package, contributing to improved flexibility in component placement on the PCB ...

Rutronik expands franchise portfolio to include Axelera AI, European pioneer in the field of AI inference at the edge.

Utilising Infineon's improved .XT die attach interconnection technology, the G2 devices achieve more than 15 percent lower ...

These support Mode 3 charging, which stipulates built-in control and protection functions for safety, and can charge an EV at ...

TI's single-chip battery fuel gauges use adaptive Dynamic Z-Track technology for more efficient battery powered devices.

Renesas' 64-bit RZ/G3E MPU has been optimised for high-performance Human Machine Interface (HMI) applications.

SiMa.ai, a developer of a MLSoC platform, has announced the next phase of its strategic collaboration with Synopsys.

Arm CEO Rene Haas has revealed that the company is stepping up investment in chiplets and solutions development.

The new 9th generation BiCS FLASH 512Gb TLC, developed using a 120-layer stacking process based on 5th generation BiCS FLASH ...

Moxa Europe achieves EU type-examination certification under Radio Equipment Directive Delegated Act (RED-DA).

European electronic components distribution market has yet to show any clear signs of recovery according to DMASS.

Brazilian operator Revo signed up for 50 of Eve Air Mobility’s four-passenger planes. Like competitors Bell Textron, Joby ...