Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to ...

A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static storage of AI model weights, with optimized read speed. Samples are due out later ...

Ensuring automotive chips are reliable, defect-free, and secure adds a whole new dimension to design for testability (DFT).

GPU rasterizer for computational lithography; restructuring techniques; inline memory encryption; automotive electronic ...

The laser provides the carrier, which is modulated and manipulated by the transmitter optical engine through fibers and ...

The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and ...

The shift to HBM4 and HBM5 will increase the pressure for shift-left test flows. Taller high-bandwidth memory (HBM) stacks ...

A new technical paper, "Challenges and prospects of 2D electronics for future monolithic complementary field-effect transistors," was published by researchers at Sungkyunkwan University, Hangyang ...

A new technical paper, “Challenges and prospects of 2D electronics for future monolithic complementary field-effect ...

A new technical paper, “Early Functional Safety and PPA evaluation for faster digital design development,” was published by ...

The industry's aspirations for machine learning are running ahead of the data plumbing required to support them.

Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.