Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on substrate (CoWoS) advanced packaging technology provided by TSMC. Huang ...

More importantly, TSMC reported revenue growth of 58% and 34% in the final two months of 2024. As Nvidia's fiscal fourth quarter of 2025 coincides with these three months, there is a solid chance that ...

Korean firms accelerate glass substrate development to challenge Nvidia, TSMC Domestic tech giants ramp up glass substrate ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

ASE Technology Holding Co., the world's largest chip packaging and testing provider, said on Thursday it expects its revenue ...

The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

Experts at the Table: Semiconductor Engineering sat down to discuss advances in packaging with Michael Kelly ... All you have to do is look at the growth in the revenue of NVIDIA. The other trend is ...

Additionally, Nvidia has reportedly been allocated 60% of TSMC's advanced chip packaging capacity this year.

So, Nvidia is on track to corner most of the incremental spending on AI chips this year. Even better, the doubling of advanced chip packaging capacity by Nvidia's foundry partner Taiwan ...