Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Glass substrates are entering a critical pre-mass production phase as demand for high-performance AI chips accelerates. As AI ...

No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...

LG Innotek is expanding its focus beyond camera module manufacturing and is preparing to venture into the field of next-generation glass substrates. The company has revealed its intention to produce ...

In a nutshell: TSMC is venturing into uncharted territory with a novel approach to advanced chip packaging. The chipmaker reportedly plans to switch from conventional round wafers to rectangular ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

In previous studies of thin film wrinkling on soft substrates, the mechanics models usually assume plane-strain deformation, which was found to disagree with experimental observations for narrow thin ...

A recent article published in RSC Applied Polymers proposed re-processible electronic substrates based on photopolymerizable polyimides to mitigate electronic waste (e-waste). These high-performance, ...