Introduction to 3D Integration in VLSI Circuits Over the years, the field of VLSI circuits has witnessed remarkable advancements. One such breakthrough is the advent of 3D integration, which has ...

In a recent IEEE 2023 Symposium on VLSI Technology and Circuits study, Prof. Takayuki Ohba and colleagues have proposed a technology called "Bumpless Build Cube 3D" or BBCube 3D.

Introduction: VLSI or Very Large Scale Integration has emerged as a crucial field in electronics engineering over the past few years. With the manufacture of complex integrated circuits (ICs) with ...

Indium compounds are showing great promise for 3D in-memory compute and RF integration, but more work is needed. Researchers continue to make headway into 3D device integration particularly with ...