Introduction to 3D Integration in VLSI Circuits Over the years, the field of VLSI circuits has witnessed remarkable advancements. One such breakthrough is the advent of 3D integration, which has ...

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute's progress on 3D integration technologies, which are a promising approach for ...

By Cheryl Ajluni At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible ...

In a recent IEEE 2023 Symposium on VLSI Technology and Circuits study, Prof. Takayuki Ohba and colleagues have proposed a technology called "Bumpless Build Cube 3D" or BBCube 3D.

Introduction: VLSI or Very Large Scale Integration has emerged as a crucial field in electronics engineering over the past few years. With the manufacture of complex integrated circuits (ICs) with ...

Indium compounds are showing great promise for 3D in-memory compute and RF integration, but more work is needed. Researchers continue to make headway into 3D device integration particularly with ...

CEA-Leti has announced a significant FDSOI CMOS processing breakthrough, having pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains ...