GlobalFoundries, New York Advanced Packaging and Data center

GlobalFoundries to build new chip packaging center
GlobalFoundries in Malta will create a new center for semiconductor manufacturing, Governor Kathy Hochul announced on Friday.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next 10-plus years. These efforts are expected to create approximately 100 new full-time GF jobs in New York over the next five years.
GlobalFoundries to build advanced packaging center in Malta, NY
New York Gov. Kathy Hochul announced on Friday that semiconductor manufacturer GlobalFoundries will be creating a new center for advanced packaging and testing in Saratoga County. GlobalFoundries is seeking to expand capabilities within its existing Malta facility.
GlobalFoundries Plans New York Advanced Packaging And Photonics Center
GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center.
GlobalFoundries to create center for advanced packaging, testing of chips in NY
GlobalFoundries (GFS) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.
GlobalFoundries plans $575M advanced packaging facility in New York
GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by up to $20M in aid from the State of New York and up to $75Min direct funding from the U.
Manufacturing8h
Department of Commerce Announces $1.4B to Support Semiconductor Advanced Packaging
The funds will enable new technologies to be validated and transitioned at scale.
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Innovations Driving The Advanced Packaging Roadmap: Part One
Advanced IC substrates (AICS ... However, finding these defects is difficult with an automated optical inspection (AOI) system. The reason: the grain boundaries on top of the rough copper generate ...
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YES Receives Multiple Orders of VertaCure PLP Systems for Advanced Packaging
YES announced today that it has received multiple orders of its VertaCure PLP systems for advanced packaging from a leading semiconductor manufacturer in Japan. These systems will be utilized ...
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Samsung mulls revamp of advanced packaging supply chain amid HBM chip race - report
The company's potential restructuring of its advanced packaging supply chain includes a review of the existing system while establishing a new supply chain with the goal of strengthening its ...
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors are protected.
Semiconductor Engineering1d
Advanced Packaging: A Curse Or A Blessing For Trustworthiness?
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and risks. While in the past the trend was toward more and more integration on a ...
Nvidia increases demand for TSMC's advanced packaging
Nvidia (NASDAQ:NVDA), the U.S. AI chip giant, continues to demand advanced packaging from Taiwan Semiconductor Manufacturing ...