NextBigFuture

3D nanomagnetic logic could extend computer speed improvement

lectrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits. Their experiments show that future computer chips could ...
Design-Reuse

Tier Logic announces innovative 3D-FPGA technology: low-cost FPGAs & no-risk, timing-exact ASICs

Santa Clara, Calif., March 10, 2010. Tier Logic, Inc., a privately held fabless semiconductor company, today introduced its new 3D-based technology for FPGAs and ASICs, known respectively as its ...
Design-Reuse

IMEC sets major step towards 3D integration of DRAM on logic

Leuven, Belgium – Ocotober 1, 2009 – IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as ...
Machine Design

Researchers 3D Print Mechanical Logic Gates

Lawrence Livermore National Laboratory scientists and engineers combed mechanical computing with 3D printing to create “sentient” materials that respond to changes in their surroundings, even in ...
EDN

IMEC claims major step toward 3D integration of DRAM on logic

IMEC reported this morning that it and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. IMEC said the 3D demonstrator mimics all ...
EDN

Imec Teams With Cadence to Present Automated Design-for-Test (DFT) Solution for 3D Memory-on-Logic

Leuven, Belgium, January 22, 2013 – At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together ...
Semiconductor Engineering

Practical Methods To Overcome The Challenges Of 3D Logic Design

What should you do If you don’t have enough room on your floor to store all your old boxes? Luckily, we live in a 3D world, and you can start stacking them on top of each other. The Challenge: How can ...
Nanowerk

A new dimension for integrated circuits: 3D nanomagnetic logic

(Nanowerk News) Electrical engineers at the Technische Universität München (TUM) have demonstrated a new kind of building block for digital integrated circuits. Their experiments show that future ...
Semiconductor Engineering

3D-Printed Logic Gates and Resettable Fuses, Via Material Extrusion (MIT)

A new technical paper titled “Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses” was published by researchers at MIT. “This work reports the first active electronics fully ...